What we have on the bench
Capabilities, not promises.
Numbers from our shop. If your project sits inside these limits, we can quote it. If it sits outside, send the project anyway — we'll tell you yes/no within a day.
// Process limits
What fits on our bench.
| Min component | 0201 passives, 0.3 mm pitch BGA, 0.4 mm pitch QFN/TSSOP |
|---|---|
| Min ball / lead count | 2 (0201) / 4 (CSP) up through 1156-ball BGA |
| Max board dimensions | 320 × 240 mm |
| Max layer count | 12 layers (assembly), 12 layers (design) |
| Sides | Single or double-sided assembly |
| Solder alloys | SAC305, SAC0307, Sn63Pb37 (leaded). Mixed-process supported. |
| Flux types | No-clean (default), water-soluble (on request) |
| IPC class | Class 2 standard, Class 3 on request (extra inspection time) |
| Volume range | 1 prototype to 1000-board production runs. 1000+ routed to a partner CM. |
// Inspection
How we verify the work.
| X-ray | Standard on every BGA and any reworked site. Customer receives X-ray images with the job. |
|---|---|
| AOI | Automatic optical inspection on solder joints, every board on a build run. |
| Stereo microscope | 10−40× for hand-soldering and rework. Used on every fine-pitch joint. |
| Electrical test | Continuity / isolation on rework sites. Power-on test if customer supplies expected behavior. |
| Thermal imaging | Available for power-board bring-up and hot-spot diagnostics. |
| Documentation | Photo log on every job. Build sheet on assembly runs. X-ray + AOI images attached to delivery. |
// Equipment
What's on the floor.
Tools are a means to an end, but it's worth knowing what's making your board.
| BGA rework | Hot-air rework station with bottom-side preheat, programmable reflow profiles |
|---|---|
| SMT line | Stencil printer, pick-and-place, convection reflow oven, AOI |
| X-ray inspection | Through-board X-ray for void analysis on BGAs |
| Microscopes | Stereo zoom microscope (10−40×), digital inspection scope with photo capture |
| Hand soldering | Temperature-controlled irons, hot-air rework, fume extraction at every bench |
| Test & measure | Multimeter, oscilloscope, programmable bench supply, electronic load, thermal camera |
| CAD | KiCad 7+, Altium Designer, Eagle/OrCAD import |
// Quality & standards
Standards we work to.
- IPC J-STD-001 — soldering process standard. Our hand-soldering operators are trained against this.
- IPC-A-610 — acceptability of electronic assemblies. Our inspection criteria.
- IPC-7711/7721 — rework, modification, repair of electronic assemblies.
- JEDEC J-STD-020 — moisture/reflow sensitivity classification. We follow MSL handling for sensitive packages.
- ESD — ESD-controlled benches throughout the shop. Operators wrist-strapped, components in static-shielding bags.
We are not currently ISO 9001 / IATF 16949 / AS9100 registered. If your program requires registered suppliers, we will route you to a partner.
Project sitting outside these limits?
Send it anyway. The numbers above are the floor — we'll tell you yes or no within a day.
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