BGA Rework
Removal, reballing, reflow on packages from 0.3 mm pitch up. X-ray verified before return.
Eight services. One shop floor.
From single-prototype assembly to small-volume production runs, BGA rework on a dead board to a ground-up PCB design. Same engineers, same quality bar, on every job.
Removal, reballing, reflow on packages from 0.3 mm pitch up. X-ray verified before return.
Stencil, pick-and-place, reflow, AOI. From 1 prototype to 1000 boards. Class 2 standard, Class 3 on request.
Microscope-assisted hand soldering for fine-pitch, RF, flex, and rework that machines can't touch.
Recover BGA components from end-of-life or damaged boards. Stencil reballing with optical and X-ray verification.
Send Gerbers, BOM, schematic. We source parts, assemble, power-up test, and ship working prototypes.
Trace repair, component replacement, BGA reflow, conformal-coat removal. Photo log on every step.
Layout, stack-up, controlled impedance, DFM. Hand off Gerbers ready to fabricate, in KiCad or Altium.
Block diagram to schematic capture. Power tree, MCU/SoC selection, BOM with second-source options.
Tell us what's on your bench and we'll point you at the right one. Most quotes returned same business day.
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