Rework
BGA Rework, done right.
Remove a failed BGA. Reball it (or replace it). Reflow it back. X-ray it. Photo-document every step. Urgent jobs back in 24–48 hours when the project can't wait.
// What this is
What BGA rework actually involves.
If a BGA on your board has cracked joints, a popcorn-damaged package, or you simply need to swap the chip for a different rev — this is the service. We remove it cleanly, reball if reusable, and reflow the new (or recovered) part back onto the board.
Squidtronic does BGA rework at its bench in Austin, Texas. Engineers in the Austin area can visit by appointment; everyone else ships boards to us from anywhere in the US.
You send the board (and a replacement chip if you have one). We handle the rest: hot-air removal, pad cleaning and re-tinning, optional reballing, alignment under stereo microscope, controlled-profile reflow, and X-ray inspection. The board comes back with a photo log and the X-ray images so you can confirm the joint quality before integrating.
Chip worth saving? If the BGA itself is good and only the balls are damaged, reballing is cheaper than replacing it.
See IC Reballing// Capabilities
Specs we work to.
The numbers below are the floor. Most jobs sit comfortably inside these — if yours doesn't, send a photo and we'll tell you yes/no within a day.
Equipment listed reflects what's on our bench today. Tools are a means to an end, but it's worth knowing what we're using on your board.
| Min pitch | 0.3 mm (0.25 mm WLCSP case-by-case) |
|---|---|
| Min ball count | 4 balls (CSP) up through 1156 balls |
| Max board size | 320 × 240 mm |
| Solder alloys | SAC305, SAC0307, SnPb (Sn63Pb37) |
| Reflow profile | Custom profile per package, JEDEC J-STD-020 compliant |
| Inspection | X-ray on 100% of reworked sites; AOI for adjacent passives |
| IPC class | Class 2 standard, Class 3 on request (extra inspection time) |
| Equipment | BGA rework station, stereo microscope, X-ray inspection |
| Typical turnaround | 5–7 business days standard; rush 2–4 days; urgent 24–48 h (+25–50%) |
| Documentation | Photo log + X-ray images delivered with every job |
// Process
From your bench to ours and back.
Send us photos and Gerbers
Quote form takes 2 minutes: package size, pitch, board photo, what's failed. Gerbers help but aren't required for rework.
We quote — usually same day
Fixed price by complexity tier. We flag any DFM concerns (e.g., neighbor-component height, missing pads) before you ship.
You ship the board (and replacement chip if needed)
Insured, traceable shipping. We email a confirmation the moment it lands on the bench.
We rework, photographing each step
Pre-removal, post-removal pad condition, re-tinned pads, aligned new component, post-reflow X-ray. You get the full set.
Test & return-ship
Continuity / impedance check on the rework site. Optional power-on test if you provide a fixture. Tracked return shipping.
// Pricing
Quote-only.
Every project is priced individually. Send the details and we’ll come back same business day with a fixed-price quote, a lead time, and any DFM red flags.
// Gallery
What you get back.
Every job leaves here with a photo log and the X-ray images, so you can confirm joint quality before you integrate the board. Want to see prior work on a specific package before you commit? Mention the package on your quote request and we'll send relevant samples, NDA permitting.
// FAQ
Common questions.
Do I need to send the replacement chip, or do you source it?
Will you reball a BGA recovered from another board?
What if the rework finds a deeper problem (lifted pad, broken trace)?
Can you handle leaded packages on a Pb-free board?
What's your warranty on the rework site?
Have a board with a sick BGA?
Send photos, package size, and pitch. We'll come back with a fixed price and a lead time, usually same business day.
Request a Quote →