Service 04 · Reballing

Reball it. Reuse it.

Salvage a BGA from a dead board. Convert leaded balls to lead-free. Refresh oxidized balls before re-flowing. Stencil-reballed, X-ray verified, lot-traced back to your part.

Request a Quote → How it works

SAC305 / SnPbStencil reballingX-ray verifiedLot-traced

// What this is

Three reasons people reball.

Either the chip is end-of-life and the only supply left is on dead boards. Or you bought leaded BGAs and need lead-free. Or the balls have oxidized in storage and won't wet on reflow. We do all three.

Reballing is mechanical work that rewards careful preparation: clean the pads down to copper, alignment is everything, and the reflow profile must match the alloy you're putting on. We do all of that under microscope and verify with X-ray before we hand the part back.

Reballing & reflowing in one go? Combine with our BGA Rework service for a single quote.

See BGA Rework

// Capabilities

Specs we work to.

Min pitch	0.3 mm
Min ball count	4 (CSP) up through 1156
Method	Stencil reballing under stereo microscope
Solder alloys	SAC305, SAC0307, SnPb (Sn63Pb37). Cross-conversion supported.
Pad prep	Solder wick + flux clean, copper-bright before stenciling
Inspection	Optical 100% + X-ray on the full ball field before return
Lot tracking	Each batch keeps its date code, lot, and source
Throughput	1–500 chips per run

// Process

Five careful steps.

You ship parts (or boards we recover from)

If parts are still on a host board, we remove them as part of the quote.

Pad prep

Wick off old solder, flux clean, optical inspect for lifted pads or cratered substrate. We stop and email if we find damage.

Stencil reball

Pitch-matched stencil + alloy-matched preforms or paste, reflowed to a JEDEC-compliant profile.

Optical + X-ray verify

Ball-by-ball optical scan, X-ray on the full field. Voids and missing balls flagged before pack-out.

Pack & return-ship

JEDEC dry-pack with desiccant + HIC, ESD bag, lot label, X-ray images delivered with shipment.

// Pricing

Quote-only.

Every project is priced individually. Send the details and we’ll come back same business day with a fixed-price quote, a lead time, and any DFM red flags.

Request a Quote →

// FAQ

Common questions.

Will the IC survive reballing?

Most do. Risk goes up with age (moisture-saturated packages can popcorn) and with already-cratered substrates. We pre-inspect and flag concerns.

Can you cross-convert leaded to lead-free?

Yes — common request for inheriting a SnPb-only part into a lead-free production line. We document the conversion.

How do you keep batches from mixing?

Each customer batch travels in its own labelled tray with a job tag from arrival through pack-out. We do not commingle batches.

Got an EOL BGA you need to reuse?

Send a part number and quantity. We'll quote pad-prep, reballing, alloy, and lead-time.

Request a Quote →